METHODS AND APPARATUS FOR BONDING ELECTRICAL MEMBER TO SUBSTRATE

摘要

A bonded structure formed by connecting an electrical member to a substrate. A plurality of conductive bumps is located on the electrical member surface and a plurality of contact pads is located on a substrate. At least one of the conductive pads aligned with a non-planar area of the electrical member or substrate and having a surface area larger than a contact pad located outside the non-planar area. The conductive bumps are joined with the conductive pads.