发明名称 MULTILAYER CAPACITOR AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor which can be markedly reduced in ESL (equivalent series inductance) and to provide its manufacturing method. <P>SOLUTION: The multilayer capacitor 10 is equipped with a dielectric assembly 12 composed of laminated dielectric layers 12a and 12b, an inner unit 17 composed of first inner conductor layers and second inner conductor layers which are each alternately laminated through a dielectric layer, outer units 19a and 19b which are provided adjacent to both end faces of the inner unit 17 and composed of first outer conductor layers and second outer conductor layers which are laminated through a dielectric layer 12b, and first terminal electrodes and second terminal electrodes formed on the side faces. The first terminal electrodes are connected to the second inner conductor layers and second outer conductor layers, and the second terminal electrodes are connected to the second inner conductor layers and second outer conductor layers. The dielectric layer 12b of the outer unit 19a and 19b is equipped with pinhole conductors 20 which connect the outer conductor layers of a pair of the first outer conductor layers or a pair of the second outer conductor layers together. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008112896(A) 申请公布日期 2008.05.15
申请号 JP20060295682 申请日期 2006.10.31
申请人 TDK CORP 发明人 TOGASHI MASAAKI
分类号 H01G4/30;H01G2/00;H01G4/12;H01G4/232 主分类号 H01G4/30
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