| 摘要 |
PROBLEM TO BE SOLVED: To provide a small semiconductor device having high heat exhausting efficiency. SOLUTION: The semiconductor device 1 is provided with a semiconductor element 2 having a first main surface having an electrode 4 formed thereon, a wiring board 3 having a second main surface having a wiring conductor formed thereon, connection terminals 5 disposed between the first main surface and the second main surface and electrically connecting the electrode 4 to the wiring conductor, and a junction material 6 disposed so as to surround the connection terminals 5 between the first main surface and the second main surface and joining the first main surface to the second main surface. The wiring board 3 is provided with a flow passage 7 through which a cooling fluid for cooling the semiconductor element 2 flows in its inside, and the flow passage 7 has an opening provided on the second main surface in the inside of the junction material 6. COPYRIGHT: (C)2008,JPO&INPIT |
