CURABLE COMPOSITION HAVING IMPROVED THIN-LAYER CURABILITY AND METHOD FOR IMPROVING THIN-LAYER CURABILITY

摘要

PROBLEM TO BE SOLVED: To provide a composition having good thin-layer curability and a method for improving thin-layer curability. SOLUTION: The curable composition for sealing materials having a thin layer portion of a thickness of 1 mm or less comprises: (A) an organic polymer having at least one reactive silicon group and (B) a divalent carboxylic acid tin salt having an acid radical of a carboxylic acid having a boiling point of 270°C or higher; or (A) an organic polymer having at least one reactive silicon group and (B) a divalent carboxylic acid tin salt having an acid radical of a carboxylic acid having 11 or more carbons; or (A) an organic polymer having at least one reactive silicon group and (B) a divalent carboxylic acid tin salt having a weight loss on heating of 10 wt.% or less. COPYRIGHT: (C)2008,JPO&INPIT