Method for manufacturing packaged components, involves mounting plate-like top substrate on support substrate, where trenches are added on exposed side of plate-like top substrate

摘要

The method involves mounting a plate-like top substrate (1) on a support substrate (18). Trenches (20) are added on an exposed side of the plate-like top substrate. The plate-like top substrate is divided, so that a composite part is formed having the support substrate and individual top parts which are isolated from one another by the trenches. The top parts of the composite part are connected to a functional substrate having multiple of components. The connection between the top parts and the support substrate is broken and the support substrate is removed, so that a composite is formed.