发明名称 |
LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, METHOD OF MANUFACTURING WIRING SUBSTRATE, METHOD OF MANUFACTURING DISPLAY APPARATUS AND WIRING SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a simple and reliable laser processing method in which both of improvement in manufacture yield and reduction in manufacture throughput can be obtained. <P>SOLUTION: The laser processing method includes: selecting, for a processing object 3 having a multilayer film formed of two or more layers with different materials, a wavelength of a laser beam L based on the reflectance of each layer constituting the multilayer film; and irradiating the processing object with the laser beam L. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008110401(A) |
申请公布日期 |
2008.05.15 |
申请号 |
JP20070262602 |
申请日期 |
2007.10.05 |
申请人 |
SONY CORP |
发明人 |
SHIMODA KAZUTO;KOSHIISHI AKIRA;TOMIOKA SATOSHI;KAWABE HIDEO |
分类号 |
B23K26/00;B23K26/36;B23K101/42;G02F1/1343;H01L21/3205;H01L23/52;H05K3/00;H05K3/22 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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