| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing a device which includes a defect analysis method capable of qualitatively identifying the influence of the number of defects in a single step on yields. SOLUTION: The presence or absence of new defects in a predetermined step is determined and the quality of each chip is checked using an electric tester. Thereafter, a plurality of chips on a wafer are classified under four kinds of (1) no new defects/non-defective items, (2) no new defects/defective items, (3) new defects/non-defective items, and (4) new defects/defective items. The number of new defective chips presumed to be made defective only by new defects in the predetermined step, the criticality of chips presumed to be made defective by new defects in the predetermined step, and the number of defective chips presumed to be made defective in the predetermined step are determined based on the classification result. COPYRIGHT: (C)2008,JPO&INPIT
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