| 摘要 |
Provided is an optical sensor module including a printed circuit board (PCB) having a pad with a perforated portion formed in the central portion thereof; a lens disposed on the top surface of the pad so as to cover the perforated portion; one or more light sources disposed around the lens; an image sensor closely attached to the bottom surface of the pad; and a housing mounted to surround the outer periphery of the image sensor, the housing having the same height as that of the image sensor and the same size as that of the pad.
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