Semiconductor component for use in semiconductor chip package, has electrode contact point arranged on substrate, where external connection having conductive liquid is arranged on point, and container arranged on point is filled with liquid

摘要

The component has a semiconductor substrate (10), and an electrode contact point (12) arranged on the substrate. An external connection (20) having conductive liquid (24) is arranged on the contact point. An elongated container (22) that is arranged on the contact point is filled with the liquid. The container extends from the contact point into the external connection. The liquid is configured such that it solidifies when exposed to air, where viscosity of the liquid ranges from 10 centipoises (cps) to 500 cps. The conductive liquid contains metal paste, conductive ink, or nano-metal-sol. An independent claim is also included for a method for manufacturing a semiconductor component.