发明名称 PLATING FIXING SOLUTION
摘要 A fixing ink for plating is provided to facilitate plating performed between heterogeneous materials, for example metallic plating on a plastic substrate, thereby improving the productivity, workability and cost-efficiency. A fixing ink for plating is obtained by introducing 250 g of a first composition containing 65 wt% of an acryl styrene resin, 5 wt% of a curing agent, 5 wt% of styrene rubber and 25 wt% of butadiene rubber in portions into 1 liter of a second composition containing 40% of methyl ethyl ketone, 10% of butyl acetate, 10% of ethyl cellosolve and 40% of cellosolve acetate, followed by melting and agitating for 2-3 hours. A dye with a desired color is optionally added during the melting and agitating step.
申请公布号 KR20080042317(A) 申请公布日期 2008.05.15
申请号 KR20060110568 申请日期 2006.11.09
申请人 GALTRONICS KOREA CO., LTD. 发明人 LEE, BOG HEANG
分类号 C09D11/03;C09D11/02 主分类号 C09D11/03
代理机构 代理人
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