SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to electrically connect input/output pads having a fine pitch and a mounting substrate by using conductive wires. A bond finger(102) is formed on a mounting substrate(101). At least one semiconductor chips(110,120) are arranged on the mounting substrate. Bonding pads(114,124) are formed on the semiconductor chips. A first molding member(130) is formed on the mounting substrate to cover the bond finger and the bonding pads. A mutual connecting passage(140) is formed in the first molding member to connect the bond finger and the bonding pads. A conductive wire(150) is formed on the mutual connecting passage. A second molding member(160) is formed on the mounting substrate to cover the semiconductor chip. The first molding member includes silicon. The mutual connecting passage has an injection hole where a conductive material is implanted from the outside of the first molding member.