CIRCUIT ARRANGEMENT COMPRISING A POWER MODULE COMBINED WITH A PRINTED CIRCUIT BOARD

摘要

A circuit arrangement including a power module combined with a printed circuit board is provided to prevent corrosion of the printed circuit board, a welding component, and the power module by preventing infiltration of moisture. A circuit arrangement(10) includes a power module(12) and a printed circuit board(14). The power module and the printed circuit board are installed between a heat sink(16) and a compressor(18) and are welded to each other by a welding component. The power module includes at least one module substrate element(22) and a housing(24). The housing has a shaft for the welding component. The welding component is welded to the module substrate element and the printed circuit board. The shaft includes the power module opened from a base of the housing facing the printed circuit board in an opened orifice.