发明名称 |
Compositions for use in electronics devices |
摘要 |
<p>A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.</p> |
申请公布号 |
EP1594351(A3) |
申请公布日期 |
2008.05.14 |
申请号 |
EP20050009792 |
申请日期 |
2005.05.04 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
MCCORMICK, DEMETRIUS;NOWICKI, JAMES W.;CHENG, CHIH-MIN;O'HARA, WANDA |
分类号 |
H05K3/32;C09J163/00;H01B1/00;H01B1/20;H01L21/60;H05K1/16 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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