| 摘要 |
A polishing method and a polishing apparatus are provided to prevent a dishing effect and corrosion on a surface of a layer after a polishing process. A polishing unit(604,605,606,607) performs a first polishing process of a layer for forming a top layer of a workpiece and a second polishing process of the remaining top layer and the next top layer. A measurement unit measures the thickness of the top layer of the workpiece before the polishing processes. A control unit determines a polishing rate of the top layer in the first and second polishing processes on the basis of the thickness of the top layer before the polishing processes and a polishing time of the top layer during the first and second polishing processes. The control unit sets a process time for the first polishing process of an nth workpiece on the basis of a polishing rate of the top layer and a thickness of a layer for forming a top layer of the nth workpiece before the polishing processes.
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