Thermoelectric refrigerating device

摘要

The heat from the TEC device (1) is dissipated by thermal convection of a coolant 8 which directly contacts the TEC. A flow splitter 11 may be included in the heatsink to facilate thermal transfer. The heatsink may include flexible elements such as fins to accommodate thermal expansion or contraction. A sealant 6 bonds and seals the heatsink with the TEC device.