发明名称 TRIMMING UNIT AND WAFER HAVING PADS OUT OF A CHIP
摘要 <p>A trimming apparatus is provided to reduce the area of a chip by forming a trimming pad in the space of a scribe lane between chips. A fusing resistor is positioned in a chip. A trimming pad(220) applies a voltage or current for trimming the fusing resistor. The trimming pad is positioned in a scribe lane outside the chip. A switch(310) can be positioned between the trimming pad and the fusing resistor. A trimming mode pad can turn on the switch. The trimming mode pad is positioned in the scribe lane. The switch can be a MOS transistor or a transmission gate switch.</p>
申请公布号 KR20080041758(A) 申请公布日期 2008.05.14
申请号 KR20060109720 申请日期 2006.11.08
申请人 ADTECH CO., LTD. 发明人 CHOI, YUN KYU
分类号 H01L23/50;H01L21/82;H01L23/62 主分类号 H01L23/50
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