发明名称 Connection structure of circuit substrate
摘要 The present invention provides an improved connection for circuit substrates. The circuit substrates are connected at concave and convex portions at their ends. The concave portion is formed such that the inside width is larger than the entrance width. The convex portion fits into the concave portion. Thereby, a connected portion of the circuit substrates has increased tensile strength. Furthermore, abnormality of the connected portion of the circuit substrates may be easily perceived.
申请公布号 US7371071(B2) 申请公布日期 2008.05.13
申请号 US20040877752 申请日期 2004.06.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO SUNG-DAE;LEE JOO-HYUNG
分类号 H01L21/60;H01R12/00;B65D85/30;H01L23/13;H05K1/00;H05K1/14;H05K3/00 主分类号 H01L21/60
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