| 摘要 |
A semiconductor device manufacturing method capable of improving the semiconductor device manufacturing yield is disclosed. Semiconductor chips are mounted respectively over semiconductor device regions of a matrix wiring substrate having plural semiconductor device regions, followed by wire bonding, and thereafter sealing resin is formed at a time onto the semiconductor device regions. Thereafter, target marks for dicing are formed on an upper surface of the sealing resin on the basis of target marks pre-formed on an upper surface of the wiring substrate. Then, half-dicing is performed from the upper surface side of the sealing resin 5 a on the basis of the target marks for dicing to form grooves whose bottoms reach the wiring substrate. Subsequently, solder balls are connected to a lower surface of the wiring substrate and dicing is performed from a lower surface side of the wiring substrate for division into individual semiconductor devices.
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