发明名称 |
HIGH SPEED CIRCUIT BOARD AND METHOD FOR FABRICATION |
摘要 |
A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of maki ng these structures have also been provided. |
申请公布号 |
CA2454289(C) |
申请公布日期 |
2008.05.13 |
申请号 |
CA20032454289 |
申请日期 |
2003.12.29 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
LIN, HOW T.;CHAN, BENSON;LAUFFER, JOHN M.;MARKOVICH, VOYA R.;THOMAS, DAVID L. |
分类号 |
H05K1/00;H01L23/12;H01L23/31;H01L23/538;H01L25/065;H01L25/18;H05K1/02;H05K1/11;H05K3/46 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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