| 摘要 |
A method of manufacturing an electronic part in which on the upper surface of an insulating member covering lower layer wiring, a conductor portion connected from the lower layer wiring is exposed. In this method, electric power supplying film is formed on the upper surface of the insulating member, whereafter an opening portion having the lower layer wiring as a bottom is formed from the electric power supplying film side. Then metal plating is grown from the edge portion of the electric power supplying film from the opening portion with the electric power supplying film as an electrode, and the opening portion is filled with the metal plating closely contacting with the lower layer wiring to thereby form a conductor portion.
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