| 摘要 |
A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each of the heat dissipating fins is predetermined when assembling to constitute the structure. The heat dissipating fins are completed from a single stamping, and can be assembled to form heat dissipation areas of different spacing to accommodate a cool air flow being fanned from different oriented fans, thereby reducing obstruction and disturbance of the air flow and rapidly and smoothly guiding the air flow to other heat dissipating fins. Moreover, the heat dissipating structure enlarges area of heat circulation, thereby augmenting speed of heat diffusion, improving heat dissipation effect on heat emitting from computer electronic components, and enhancing functionality of the fan.
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