| 摘要 |
A semiconductor device includes a lower substrate having wiring patterns formed of a plurality of wirings, semiconductor chips located above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chips in columnar form and substantially, and a resin board which substantially covers the entire upper surface of the intermediate member. A thermal expansion coefficient of the resin board and a thermal expansion coefficient of the lower substrate are made approximately identical to each other.
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