发明名称 |
Image sensor device and methods thereof |
摘要 |
An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The adhesive layer may be removed so as to expose the protective layer. The protective layer may be removed so as to expose the at least one microlens, the exposed at least one microlens not including residue from the adhesive layer. The at least one microlens may have an improved functionality due at least in part to the lack of residue from the adhesive layer. In an example, the at least one microlens may be included in an image sensor module.
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申请公布号 |
US7371614(B2) |
申请公布日期 |
2008.05.13 |
申请号 |
US20060342799 |
申请日期 |
2006.01.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON YONG-CHAI;KANG SUK-CHAE;LEE KANG-WOOK;KIM GU-SUNG;KIM JONG-WOO;HAN SEONG-IL;HEO SUN-WOOK;YI JUNG-HANG;MA KEUM-HEE |
分类号 |
H01L21/50;G02B3/00;H01L21/44;H01L21/48;H01L27/14;H04N5/335 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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