FABRICATION METHOD OF LED LAMP AND THE LED LAMP USING THIS METHOD

摘要

A method for fabricating an LED lamp is provided to improve a heat radiation characteristic as compared with a conventional high-output LED by directly radiating the heat generated by the light emitted from an LED through a substrate. An insulation layer is coated on the upper surface of a substrate(2), made of a predetermined pattern by an etch process. A metal layer is coated on the upper surface of the substrate by an etch process, having an electrode pattern(23) including a groove part on which an LED chip(3) is placed. The LED chip is directly inserted into the upper surface of the substrate through the groove part of the metal layer, connected to the electrode pattern by a wire. A reflection body(4) is inserted into the circumference of the LED chip connected to the electrode pattern wherein the upper part of the reflection body is broad and the lower part of the reflection body is narrow, having a through hole in its center to reflect the light emitted from the LED chip to the front area so that the lower part of the reflection body is open. A molding part(5) is molded by transparent resin to cover the LED chip, the electrode pattern and the reflection body. The metal layer can be made of copper.