MATERIAL AND METHOD OF MANUFACTURE OF A SOLDER JOINT WITH HIGH THERMAL CONDUCTIVITY AND HIGH ELECTRICAL CONDUCTIVITY

摘要

The present invention provides a powder blend or composite powder that is fe d into a kinetic spray device, accelerated towards a substrate or part in orde r to form a composite solder with thermal and electrical properties better than existing solder. T he other advantages of building a solder layer in this manner include a low oxide content to improv e subsequent solderability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.