发明名称 METHOD FOR FORMING ELECTRICALLY CONDUCTIVE FILM, ELECTRICALLY CONDUCTIVE FILM FORMED USING THE SAME, AND PRINTED CIRCUIT BOARD, THIN LAYER TRANSISTOR AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming an electrically conductive film to which resistance to the strong alkalinity of an electroless plating bath is imparted, which has excellent adhesion with a base material and which has satisfactory electric conductivity, and to provide an electrically conductive film formed using the method for forming an electrically conductive film. SOLUTION: The method for forming the electrically conductive film comprises: a stage where a glass base material is bonded with a radical polymerization initiator having a part capable of direct chemical bonding with the glass base material; a stage where the glass base material is brought into contact with a polymer having an unsaturated part capable of radical polymerization and a part capable of adsorbing an electroless plating catalyst in the molecules, and exposure is performed by light with the wavelength of 320 to 700 nm; and a stage where metal ions to be an electroless plating catalyst are adsorbed so as to reduce the catalyst metal ions, thus a thin film is formed, and thereafter, electroless plating treatment is performed. The electrically conductive film is formed using the same. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008106345(A) 申请公布日期 2008.05.08
申请号 JP20070047722 申请日期 2007.02.27
申请人 FUJIFILM CORP 发明人 MATSUSHITA YASUAKI
分类号 C23C18/18;C08F299/00;H01L21/288;H05K1/16 主分类号 C23C18/18
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