| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal thin film transfer material excellent in an electrostatic breaking resistance and capable of imparting excellent metal gloss free from metal gloss irregularity. SOLUTION: In the metal thin film transfer material obtained by providing a mold release layer on one side of a transparent base material film and successively forming a protective resin layer, a metal thin film layer based on Sn, and an adhesive layer on the mold release layer, the relation of the total light transmittance Tr1 (%) with the adhesion amount X (g/m<SP>2</SP>) per a unit area of Sn satisfies the numerical formula (1): Tr1<-80X+21 and the numerical formula (2): 4<Tr1<15. Alternatively, the relation of the total light transmittance Tr2 (%) with the adhesion amount X (g/m<SP>2</SP>) per a unit area of Sn satisfies the numerical formula (3): Tr2<-80X+24 and the numerical formula (4): 6<Tr2<17. Further, in a manufacturing method of a laminate, the relation of the adhesion amount D [g/(m<SP>2</SP>sec)] of Sn per a unit area and a unit time with a vacuum degree P (Pa) at that time satisfies the numerical formula (5): D/P<25. COPYRIGHT: (C)2008,JPO&INPIT
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