Electronic Device, a Chip Contacting Method and a Contacting Device

摘要

An electronic device includes a chip ( 10 ) and a carrier substrate ( 16 ), wherein the carrier substrate ( 16 ) has a conductive structure ( 18 ) and the chip ( 10 ) has a pair of bonding pads ( 13 ) on a side facing the carrier substrate ( 16 ). The bonding pads ( 13 ) are in electrical contact with the conductive structure ( 18 ). The chip ( 10 ) has a non-reductive space layer ( 14 ) on the side facing the carrier substrate ( 16 ), wherein the non-conductive space layer ( 14 ) defines the distance between the chip ( 10 ) and the conductive structure ( 16 ) of the carrier substrate ( 16 ).