发明名称 Layout transferring method for electronic module, involves transferring layout to photo-sensitive foil from plastic material by selective exposure of photo-sensitive foil, and applying selectively exposed foil on surface of substrate
摘要 <p>The method involves transferring a layout to a photo-sensitive foil (11) from plastic material by selective exposure of the photo-sensitive foil, and applying the selectively exposed foil on a surface of a substrate (10), where the photo-sensitive foil has a two-dimensional extension during the exposure. The transmission of the layout takes place using a mask, and sections (21a, 21b, 21c) of the photo-sensitive foil are shadowed by the mask, in whose place the conductive structure is designed.</p>
申请公布号 DE102006040729(A1) 申请公布日期 2008.05.08
申请号 DE20061040729 申请日期 2006.08.31
申请人 SIEMENS AG 发明人 PATZ, ERIC
分类号 G03F7/20;G03F1/88;G03F7/004 主分类号 G03F7/20
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