| 发明名称 |
ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
In a chip-on-chip type semiconductor device, an adhesive tape electricall y connects between a semiconductor chip (10) and a semiconductor chip (20). The adhesive tape contains; (A) a film forming resin of 10-50 wt%, (B) a the rmosetting resin of 30-80 wt%, and (C) a curing agent of 1-20 wt% having flu x activation characteristics. |
| 申请公布号 |
CA2667853(A1) |
申请公布日期 |
2008.05.08 |
| 申请号 |
CA20072667853 |
申请日期 |
2007.10.30 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
KATSURAYAMA, SATORU;YAMASHIRO, TOMOE;HIRANO, TAKASHI |
| 分类号 |
H01L25/065;C09J7/00;C09J133/00;C09J163/00;C09J171/10;C09J179/08;H01L25/07;H01L25/18 |
主分类号 |
H01L25/065 |
| 代理机构 |
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