发明名称 Treatment Method And Device Of The Working Layer Of A Multilayer Structure
摘要 Treatment of an electrical conducting service layer of a multi-layer structure, including an insulating layer beneath the service layer, is destined to constitute in the service layer at least one islet surrounded by the insulating layer. The treatment incorporates the chemical engraving of the service layer by a humid route. Prior to the humid engraving a selective masking of several regions in the service layer to form several islets, each masked region corresponding to a respective islet. - An INDEPENDENT CLAIM is also included for a device for treating an electrical conducting service layer in a multi-layer structure by this method.
申请公布号 KR100828113(B1) 申请公布日期 2008.05.08
申请号 KR20067018525 申请日期 2006.09.11
申请人 发明人
分类号 H01L21/00;H01L21/027;H01L21/306;H01L23/544 主分类号 H01L21/00
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