| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding device which controls grinding pressure stably even in low pressure grinding. <P>SOLUTION: The grinding device having a grinding head 30 pressing a material 50 to be ground and making it abut on a wafer is provided with an anti-pressing device 60 (an air cylinder 61) applying force in the opposite direction to the direction for pressing the material 50 to be ground on the material 50. The grinding head 30 applies the force being larger than the force applied on the material 50 by the anti-pressing device 60 (the air cylinder 61) on the material 50 to press the material 50. <P>COPYRIGHT: (C)2008,JPO&INPIT |
