| 摘要 |
There is provided a semiconductor laser apparatus capable of sufficiently discharging heat generated at a semiconductor laser element, having a simple manufacturing step, and capable of adjusting an optical path length, as well as a method for manufacturing the same. A laser chip is connected through a block and a plate to a housing. Further, the plate is partially exposed from a connecting surface between the block and the plate, and when disposed in the housing, the semiconductor chip and the block are inserted from an outside of the housing to an inside thereof, and the plate is exposed outwardly from the housing. An optical axis of an output light beam from the laser chip is in parallel to a ground plane of the housing.
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