METHOD OF BONDING WIRE OF SEMICONDUCTOR PACKAGE

摘要

A wire bonding method for a semiconductor package is provided to form a thin semiconductor package by performing a stitch bonding process without forming a loop height on a bonding pad. A ball bump(118) is formed on a bonding pad(116) formed on a semiconductor chip(112) by using a capillary(120) capable of supplying a wire(122). The wire is cut from the ball bump by the capillary. The capillary is transferred to an interconnection corresponding to the bonding pad on the semiconductor chip to perform a stitch bonding process on the wire supplied from the capillary so that the wire is stitched to the interconnection. After the capillary is transferred over the ball bump formed on the bonding pad, the wire is bonded to the surface of the ball bump by a stitch bonding process. The wire is cut from the ball bump.