SIDE VIEW TYPE SURFACE MOUNTED DEVICE LED PACKAGE AND MANUFACTURING OF THE SAME

摘要

A side view type surface mounted device LED package having lateral directivity and a method of manufacturing the same are provided to enhance light emitting efficiency and productivity by improving light extraction efficiency. A printed circuit board includes a copper or metal layer(10a) and an insulating layer(11). An electrode structure(12), a reflective structure(16), and a directional structure(14) are formed on the printed circuit board. The directional structure including the reflective structure is a chip mounting part having a concave structure. An LED chip is loaded on the concave structure. The concave structure is formed by etching partially the copper or metal layer on the printed circuit board. The concave structure is formed by depositing or plating partially the copper layer on the printed circuit board.