发明名称 |
TEMPERATURE SETTING METHOD OF THERMAL PROCESSING PLATE, COMPUTER-READABLE RECORDING MEDIUM RECORDING PROGRAM THEREON, AND TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE |
摘要 |
<p>A temperature setting method of a thermal processing plate, a computer-readable recording medium recording program thereon, and a temperature setting apparatus for thermal processing plate are provided to optimize a processing state of a final substrate by optimizing timing to change temperature setting of a thermal processing plate. A measurement process is performed to measure a processing state of a substrate(W) after a substrate treatment process including a thermal process. A calculation process is performed to calculate an improvable in-plane tendency from an in-plane tendency of the substrate of the measured processing state by changing a temperature correction value for each of regions of a thermal processing plate. A temperature correction value changing process is performed to change a temperature correction value for each of the regions of the thermal processing plate when a magnitude of the improvable in-plane tendency exceeds a threshold value set in advance.</p> |
申请公布号 |
KR20080040576(A) |
申请公布日期 |
2008.05.08 |
申请号 |
KR20070109603 |
申请日期 |
2007.10.30 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
JYOUSAKA MEGUMI;SHINOZUKA SHINICHI;OGATA KUNIE |
分类号 |
H01L21/324;H01L21/02;H01L21/027 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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