| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent flame retardancy and moisture resistance without containing a halogen compound, also having good alkali solubility, developability and solvent resistance, and excellent in balance of physical properties, a dry film resist using the photosensitive resin composition and a printed wiring board using the dry film resist. <P>SOLUTION: The photosensitive resin composition contains (A) a cyclic phenoxyphosphazene compound having at least one phenolic hydroxyl group in one molecule, (B) a polyamic acid, (C) a (meth)acrylate and (D) a photoreaction initiator as essential components. <P>COPYRIGHT: (C)2008,JPO&INPIT |
