THERMALLY CONDUCTIVE MATERIAL, HEAT RELEASING SUBSTRATE USING THIS AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve a problem that a circuit board or the like required with a predetermined strength is hardly used since in a heat releasing substrate using a conventional crystallized resin, the recrystallized resin itself for enhancing a thermal conductivity is hard and brittle.

SOLUTION: A crystalline epoxy resin 17 and a thermoplastic resin having a phenyl group 27 (or a mesogen group) such as an amorphous PPE resin 18 with a high Tg (Tg is a glass transition temperature) and high strength are mixed, and it is made to a thermal conductive insulation material in which the mutual phenyl groups 27 are oriented and crystallized and an inorganic based inorganic filler 20 is further added. Thereby, load bearing (or hardly cracking) and Tg are improved while maintaining the high thermal conductivity.

COPYRIGHT: (C)2008,JPO&INPIT