发明名称 MOLD PACKAGE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To recognize alignment deviation of a terminal part from a face side opposite to a mounting face by appearance inspection when the mounting face of mold resin is loaded on a substrate in a state where the mounting face is confronted with the substrate in a mold package where a lead frame is sealed with mold resin and the terminal part of the lead frame is exposed to a peripheral part in the mounting face of mold resin. SOLUTION: In a cutting process, a first process for cutting a connection part of the terminal parts 12 in a lead frame material 400 by using a frame blade 401 and a second process for removing a part of mold resin 30 for sealing end parts of the terminal parts 12 by cutting mold resin 30 from the other face 31-side opposite to the mounting face 32 by using a second blade 402 whose blade width W2 is larger than the first blade 401 and making the end parts of the terminal parts 12 so that they can be viewed from the other face 31-side of mold resin 30. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008108872(A) 申请公布日期 2008.05.08
申请号 JP20060289671 申请日期 2006.10.25
申请人 DENSO CORP 发明人 SUGATA TATSUYA;ASAI SHOKI;OTA SHINJI;HONDA MASAHIRO
分类号 H01L21/56;H01L21/301;H01L23/50 主分类号 H01L21/56
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