| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having excellent performance for cooling of a semiconductor chip and also provide a method for manufacturing the same semiconductor chip. SOLUTION: The semiconductor device is provided with a non-insulated semiconductor module 2 including a built-in semiconductor chip, a cooler 3 for cooling the semiconductor chip, and an insulating layer 6 formed using a polymer material as a mother material and held between the non-insulated semiconductor module 2 and the cooler 3. A swelling assisting agent 8 is penetrated and heat conductive particle 9 is added to the front surface part 6SM in the side of the non-insulated semiconductor module and to the front surface part 6SH in the side of the cooler of the insulating layer 6. Moreover, the semiconductor device also includes a heat conductive path 10 that is formed between the non-insulated semiconductor module 2 and the cooler 3 in the stage that the predetermined load is applied. COPYRIGHT: (C)2008,JPO&INPIT
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