| 摘要 |
PROBLEM TO BE SOLVED: To provide a sintering conductive paste that has extremely improved adhesion properties between a paste layer in a prescribed shape formed on a substrate surface and a substrate, has improved adhesion properties to the substrate of a conductive layer formed by baking treatment, and prevents the conductive layer formed by a shock such as friction from being separated from the substrate for the sintering conductive paste for manufacturing an electrode or the like by sintering by heating. SOLUTION: The sintering conductive paste contains an alkoxy compound having a group expressed by M-OR where alkoxy groups having 1-10 carbons are combined, and silver particles in an atom M having a first ionization energy of 8-11 eV. COPYRIGHT: (C)2008,JPO&INPIT
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