APPARATUS FOR INSPECTING FINE STRUCTURE, METHOD FOR INSPECTING FINE STRUCTURE AND SUBSTRATE HOLDING APPARATUS

摘要

Provided is an inspecting apparatus, which has a movable section (16a) supported on the both sides and inspects a fine structure. The inspecting apparatus is provided with a chuck top (9) for holding a wafer (8) whereupon the fine structure is formed, so that the main surface of the wafer (8) is in a protruding shape or a recessed shape with a substantially fixed curvature radius. Furthermore, the inspecting apparatus includes a deforming means for changing the curvature radius of the main surface shape of the wafer (8). Especially the deforming means is a temperature control means for deforming by the temperature the shape of the upper surface of the chuck top (9) whereupon the substrate is to be placed. The upper surface of the chuck top (9) may be flat, and a transfer tray, which has a protruding or recessed upper surface whereupon the wafer (8) is to be placed, may be sandwiched between the wafer (8) and the chuck top (9).