THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE

摘要

Thermoelectric module (1) utilizing the Peltier effect, exhibiting an element-occupied area ratio of 40% or below, the element-occupied area ratio defined as the ratio of the sum of areas of sections, perpendicular to the direction of electric current passage, of thermoelectric elements (5a,5b) to the area of insulating substrate (2a) in contact via metallized layer (4a) with a cooling object, wherein metallized layers (4a,4b) are provided with slits. In this construction, there can be prevented breakage of thermoelectric device by thermal stress occurring at assembly, or thermal stress occurring at preliminary soldering conducted in advance for fitting of a substance to be cooled or at fitting of package, etc.