| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device capable of raising reliability in moisture resistance. <P>SOLUTION: The amount of solder 7 for fixing the upper surface electrode exposure part 10 of a semiconductor chip 6 and an auxiliary terminal 2 is made to be appropriate, and a solder component and moisture are prevented from directly contacting an oxide film 6c, so that the reliability in moisture resistance is raised. <P>COPYRIGHT: (C)2008,JPO&INPIT |
