| 发明名称 |
METHOD OF FORMING SEPARATE FORMED-ON-FOIL THIN-FILM CAPACITOR FOR EMBEDDING INSIDE PRINTED WIRING BOARDS OR ORGANIC SEMICONDUCTOR PACKAGES |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of forming a separate formed-on-foil thin-film capacitor for embedding inside printed wiring boards or organic semiconductor package substrates. <P>SOLUTION: This invention is related to the method including a step to remove the selected portions of the capacitor by sandblasting or other means so that a ceramic dielectric may not contact acid etching liquid. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
| 申请公布号 |
JP2008109088(A) |
申请公布日期 |
2008.05.08 |
| 申请号 |
JP20070208244 |
申请日期 |
2007.08.09 |
| 申请人 |
E I DU PONT DE NEMOURS & CO |
发明人 |
BORLAND WILLIAM;MCGREGOR DAVID ROSS;AMEY DANIEL I JR;ONKEN MATTHEW T |
| 分类号 |
H01G4/33;H01G4/12;H01G4/30;H01L23/12;H05K1/16;H05K3/46 |
主分类号 |
H01G4/33 |
| 代理机构 |
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