| 摘要 |
Disclosed is a solid-state imaging device comprising a solid-state imaging device chip, a transparent plate so arranged as to face the light-receiving surface of the solid-state imaging device chip, a spacer arranged like a frame at the peripheral portion of the light-receiving surface of the solid-state imaging device chip for keeping the distance between the solid-state imaging device chip and the transparent plate constant, and an adhesive layer for sealing the periphery of the space between the solid-state imaging device chip and the transparent plate. This solid-state imaging device is characterized in that the spacer is composed of a plurality of partition walls. |
