| 摘要 |
A method for cleaning a substrate is provided to decrease a process time by moving a spray unit for spraying chemicals on the substrate to a region close to a center portion of the substrate. A substrate is divided into a first region including an edge portion and a second region including a region adjacent to a center thereof. The substrate is rotated(S100). A cleaning solution is sprayed on the substrate to remove pollutants from the substrate(S200). Deionized water is sprayed on the substrate to rinse off the cleaning solution. A spray unit for spraying chemicals moves to a predetermined position in the second region(S300). While the spray unit moves from the predetermined position to an edge region of the first region through the center of the substrate, at least one of a rotation speed of the substrate, a moving speed of the spray unit, and the spray time is variably changed during a chemical spraying process(S400).
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