| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting solder balls for mounting fine solder balls on a substrate using a mask for solder ball mounting wherein the solder balls are mounted on the substrate with accuracy and with a good workability, and also to provide a method of manufacturing a solder ball-mounted substrate. <P>SOLUTION: A solder resist 4 has first openings 6 at the positions corresponding to electrodes 3 and second openings 7 at the positions where a mask is going to be arranged. This solder resist 4 is formed on the substrate 1. Then, a mask 8 for flux having nearly the same thickness as that of the solder resist 4 is arranged in the second openings 7, and the first openings 6 are filled with a flux 9. After removing the mask 8 for flux, a mask 10 for mounting solder balls is so arranged on the substrate 1 that supporting portions 13 of the mask 10 may be located in the second openings 7. Using this mask 10 for mounting solder balls, solder balls 15 are mounted on the flux 9 on the electrodes 3. After removing the mask 10 for mounting solder balls, heat treatment is conducted to join the solder balls 15 to the electrodes 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
