| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating a semiconductor that has good flowability, curability, mold releasability and continuous moldability during the encapsulation molding process and is almost free from the occurrence of staining of the appearance of a resin cured product and staining of a mold even when the blending amount of an inorganic filler is increased. <P>SOLUTION: The epoxy resin composition for encapsulating a semiconductor comprises (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a curing accelerator and (E) a mold release agent wherein the curing accelerator comprises (D1) a curing accelerator having a cationic moiety and a silicate anionic moiety; and the mold release agent (E) comprises (E1) a pentaerythritol tetra fatty acid ester and/or (E2) a dipentaerythritol hexa fatty acid ester. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
