发明名称 APPARATUS FOR FORMING THIN FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a uniform thin film. <P>SOLUTION: The apparatus for forming the thin film has an earth electrode placed in one side of a substrate to be thin-film-formed thereon in the film-forming chamber, and a high-frequency electrode placed in the other side. The high-frequency electrode comprises a main body part of the electrode, which is connected to a high-frequency power source and has a gas-introducing port for introducing a reaction gas therethrough, and a surface electrode part having a gas circulation hole in the plate face. The earth electrode and the-high frequency electrode generates plasma discharge in between them to form the thin film on the surface to be film formed of the substrate. The high-frequency electrode 4 is formed of a plurality of surface electrodes 40 that are formed by dividing the surface electrode part and of which the end parts are folded onto each other. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008106304(A) 申请公布日期 2008.05.08
申请号 JP20060290053 申请日期 2006.10.25
申请人 FUJI ELECTRIC HOLDINGS CO LTD 发明人 TATSUKAWA MASAHIRO;SHIMOZAWA SHIN
分类号 C23C16/509;H01L21/205;H01L31/04 主分类号 C23C16/509
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