发明名称 |
APPARATUS FOR FORMING THIN FILM |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a uniform thin film. <P>SOLUTION: The apparatus for forming the thin film has an earth electrode placed in one side of a substrate to be thin-film-formed thereon in the film-forming chamber, and a high-frequency electrode placed in the other side. The high-frequency electrode comprises a main body part of the electrode, which is connected to a high-frequency power source and has a gas-introducing port for introducing a reaction gas therethrough, and a surface electrode part having a gas circulation hole in the plate face. The earth electrode and the-high frequency electrode generates plasma discharge in between them to form the thin film on the surface to be film formed of the substrate. The high-frequency electrode 4 is formed of a plurality of surface electrodes 40 that are formed by dividing the surface electrode part and of which the end parts are folded onto each other. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008106304(A) |
申请公布日期 |
2008.05.08 |
申请号 |
JP20060290053 |
申请日期 |
2006.10.25 |
申请人 |
FUJI ELECTRIC HOLDINGS CO LTD |
发明人 |
TATSUKAWA MASAHIRO;SHIMOZAWA SHIN |
分类号 |
C23C16/509;H01L21/205;H01L31/04 |
主分类号 |
C23C16/509 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|